Precision Machining of a Quartzglass Ring on the DMG MORI ULTRASONIC 50

Precision is key in the processing of advanced semiconductor materials. In this video, witness the intricate process of creating a Quartzglass ring for the semiconductor industry. Key details include:
- Dimensions: Ø 480 x 21 mm
- Material: Quartzglass
The ULTRASONIC 50 machine handles workpieces up to Ø 630 x 500 mm and 300 kg, with a powerful DirectDrive C-axis capable of reaching speeds up to 200 rpm.